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 E2U0033-28-81
Semiconductor MSM6981-01
Semiconductor 32 kbps ADPCM TRANSCODER
This version: Aug. 1998 MSM6981-01 Previous version: Nov. 1996
GENERAL DESCRIPTION
The MSM6981-01 is for performing high-efficiency compression to code an A/D converted audio-band PCM signal into an ADPCM signal with a transmission rate of 32 kbps, or conversely for converting an ADPCM signal to a PCM signal. With digital-digital conversion in particular, if this device is used as a PCM-ADPCM mutual converter (transcoder) between existing PCMs and CODECs, efficiency can be doubled with respect to conventional transmission lines without loss of call quality. This device may be used in high-speed digital dedicated line multiplexors, digital circuit multiplexors and digital PBX's, or in audio band signal coders/decoders for this kind of equipment. The MSM6981-01 cannot transfer data to and from the MSM6980-03 (MSM6980 family).
FEATURES
* Provides 9600 bps modem signal (conformed with ITU-T V.29) transmission capability * High quality transmission characteristics equal to or better than ITU-T G.721 (ADPCM specification) for voice signals and tone signals * Provides 24 kbps ADPCM transmission capability for voice signals * Can be interfaced with m-law or A-law PCM CODECs * Can operate as ADPCM encoder or decoder (selection of operation mode) * Asynchronous data input and output * Serial or parallel data interface * Usable clock rate of 32 kbps to 2048 kbps for serial input or output * Selectable 3 bit or 4 bit data conversion * Low power consumption: +5 V, 70 mW (Typ.) * Package: 42-pin plastic DIP (DIP42-P-600-2.54) (Product name : MSM6981-01RS)
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Semiconductor
PATH: Prediction filter controlled by Advanced Tchebycheff equation and Hurwitz stability
BLOCK DIAGRAM
A/m C/D 3BIT
MODE SELECT
Nonlinear AELinear
Adaptive Quantizer Adaptive Inverse Quantizer
Adaptive Zero Filter
PATH SID SICK S/P CODER BLOCK DECODER BLOCK ISYNC OSYNC IS/P Linear AENonlinear Adaptive Zero Filter P/S SOD SOCK
I/O CONT.
Adaptive Inverse Quantizer
PATH WDT P. I/O PORT VDD GND
MCK RST CKOUT
CLOCK GENE. -- PD15 to 0
MSM6981-01
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Semiconductor
MSM6981-01
PIN CONFIGURATION (TOP VIEW)
PD6 1 PD7 2 PD8 3 PD9 4 PD10 5 PD11 6 PD12 7 PD13 8 PD14 9 PD15 10 SID 11 SICK 12 ISYNC 13 MCK 14 PBS 15 RST 16 DATD 17 POWD 18 WDT 19 EXTI 20 GND 21 42-Pin Plastic DIP
42 VDD 41 PD5 40 PD4 39 PD3 38 PD2 37 PD1 36 PD0 35 SOD 34 SOCK 33 BTST 32 OSYNC 31 A/m 30 8IO 29 CNV/TH 28 3BIT 27 SADJ 26 SIGI/O 25 C/D 24 CKRST 23 IS/P 22 CKOUT
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Semiconductor
MSM6981-01
PIN DESCRIPTION
Pin Symbol Bidirectional bus interface. PD15 is the MSB pin. 1 to 10 36 to 41 PD0 to PD15 Refer to Tables 1 and 2 for the specifications and Figures 1 and 3 for the timings. When RST or OSYNC is a logic "0", all of outputs PD0 to PD15 are "1"s with an impedance of 100 kW or more. A logic "0" means low level input/output voltage and a logic "1" high level input/output voltage. 11 SID Serial data input. The bit length is 4 or 8. Refer to Fig.2. Clock signal input for serial input data. 12 SICK The maximum clock rate is 2048 kbps. The input clock count should be longer than the serial data bit length. Refter to Fig.2. 13 14 15 ISYNC MCK PBS Synchronous pulse signal input. For taking in the serial or parallel data. Main clock input. 20 MHz clock input. Chip test input. Input a logic "0" to this pin. Reset signal input. Input a logic "0" while the main clock (MCK) is input. Provide the timing indicated 16 RST in Fig.6 to make the first output data effective. While a logic "0" is input to RST, PD0 to PD15 output a logic "1" with a high output impedance of 100 kW or more, and SOD is in a high impedance state. 17 18 DATD POWD Chip test output. Chip test output. Chip test output. 19 WDT Also available for the internal observation signal. When the device is operating normally, the signal synchronized with ISYNC is output from WDT. Refter to Fig.5. 20 21 22 EXTI GND CKOUT Chip test input. Normally input a logic "1" to this pin. Ground. 0 V. Chip test output. Normally 1/4 main clock (MCK) frequency is output (5 MHz). Serial/Parallel data input select signal. Logic "1": Serial data input. Logic "0": Parallel data input. Refer to Table 1. 24 CKRST Chip test input. Normally pull this pin to a logic "1". Operating mode select input. 25 C/D Logic "1": Coding mode. Logic "0": Decoding mode. Refer to Table 1. Description
23
IS/P
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Semiconductor
MSM6981-01
Pin 26 27
Symbol SIGI/O SADJ Chip test input and output. Normally remain this pin open. Chip test input.
Description
Normally pull this pin to a logic "0". ADPCM data bit length select signal. Logic "1": 3 bits Logic "0": 4 bits Refer to Table 2. Chip test input. Normally pull this pin to either a logic "1" or "0". Chip test input. Normally pull this pin to a logic "0". PCM coding law select input. Logic "1": A-law Logic "0": m-law Parallel or serial output control. Refer to Fig.3 and Fig.4. Chip test input. Pull this pin to a logic "1". Clock input for serial data output control. The maximum output data rate is 2048 kbps. Refer to Fig.4. Serial data output. The data bit length is 4 or 8. After the determined number of bits has been sent
28
3BIT
29 30
CNV/TH 8IO
31
A/m
32 33
OSYNC BTST
34
SOCK
35
SOD
from SOD, SOD is in a high impedance state. The fourth bit is a logic "0" when the bit length is three. Refer to Fig.4.
42
VDD
+5 V power supply.
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Semiconductor Input/Output Setting Table Table-1
Operating Mode Coder Decoder Input Bit Length 8 4 (3) P/S P S P S 4 (3) 8 Output Bit Length P/S Note: P, S Note: P, S
MSM6981-01
Control Pin C/D IS/P 1 0 0 1 0 1
P: Parallel format S: Serial format Note: Output in serial or Parallel
Table to Indicate the Parallel I/O Pins Table-2
Input I/O Coder Decoder 4-bit 3-bit 4-bit MSB PD15 to 12 LSB PD11 to 8 LSB MSB PD7 to 4 MSB PD3 to 0 LSB LSB MSB LSB Coder 3-bit MSB LSB Output Decoder MSB
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Semiconductor
MSM6981-01
ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Power Dissipation Storage Temperature Symbol VDD VIN PD TSTG -- Ta = 25C Condition Rating -0.3 to +7 -0.3 to VDD + 0.3 1 -65 to +150 Unit V W C
RECOMMENDED OPERATING CONDITIONS
Parameter Operating Temperature Power Supply Voltage Master Clock Frequency Symbol Ta VDD FC Condition -- -- -- Min. 0 4.75 19.998 Typ. 25 5 20 Max. 70 5.25 25 Unit C V MHz
ELECTRICAL CHARACTERISTICS
DC Characteristics (In range of Recommended Operating Condition)
Parameter Stand-by Power Supply Current Operating Power Supply Current Input Low Voltage Input High Voltage Output Low Voltage Outpu High Voltage Input Leakage Current Input Capacitance Output Load Capacitance Symbol IDD1 IDD2 VIL VIH1 VIH2 VOL1 VOL2 VOH II CI CL Condition Master clock is not input FC = 20 MHz -- MCK, SICK, SOCK Other input pins SOD, IOL = 6.0 mA Other output pins, IOL = 1.6 mA IOH = 40 mA VIN = VDD, GND -- -- Min. -- -- 0 2.4 2.0 0 0 4.2 -10 -- -- Typ. 1.0 14 -- -- -- -- -- -- -- -- -- Max. 2.0 20 0.8 VDD VDD 0.4 0.4 VDD +10 10 100 Unit mA mA V V V V mA pF pF
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Semiconductor
MSM6981-01
TIMING DIAGRAM
Parallel Data Input
125 ms 300 ns Min.
ISYNC
PD15 to 0
Input Data
0 s Min.
400 ns Min.
Figure 1
Serial Data Input
125 ms T or more
ISYNC T SICK
SID
MSB
LSB
High-Z
50 ns Min. 0 s 50 ns Min. Min.
T : 1/32 kHz to 2048 kHz
Figure 2
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Semiconductor Parallel Data Output
125 ms 300 ns Min.
MSM6981-01
OSYNC 16 ms Max.
PD15 to 0
Output Data
100 ns Max.
100 ns Max.
Figure 3
Serial Data Output
125 ms T or more
OSYNC 50 ns Min. SOCK 50 ns Min. SOD MSB
T
LSB
High-Z
100 ns Max.
100 ns Max.
Figure 4
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Semiconductor WDT (1) Parallel data input
MSM6981-01
ISYNC
WDT
200 ns Typ.
10 ms to 20 ms
800 ns 400 ns Typ. Typ.
(2) Serial data input during coding function
ISYNC
SICK 1 2 8
WDT 10 ms to 20 ms
200 ns Typ.
800 ns Typ.
400 ns Typ.
(3) Serial data input during decoding function
ISYNC
SICK 1 2 4
WDT 10 ms to 20 ms
200 ns Typ.
800 ns Typ.
400 ns Typ.
Figure 5 10/15
Semiconductor RST
MSM6981-01
RST
1 ms Min.
ISYNC
30 ms Min.
Figure 6
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Semiconductor
APPLICATION CIRCUIT
1.544 Mbps BUS ADPCM CODER ADPCM DECODER
AIN CH1 AOUT
PCM CODEC
AIN CH2 AOUT
AIN AOUT
PCMOUT SYNC CLOCK PCMIN
SID ISYNC SICK SOD OSYNC SICK
SOD OSYNC MCK SID ISYNC MCK
AIN CH48 AOUT
AIN AOUT
PCMOUT SYNC CLOCK PCMIN
SID ISYNC SICK SOD OSYNC SICK 20 MHz
SOD OSYNC MCK SID ISYNC MCK
1.544 MHz
SYN P-A 1.544M SYN A-A
MSM6981-01
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Semiconductor
VSS
VDD
VDD
MSM6932 VSS TMC AIN AG AOUT VREF VDD PCMOUT XCLOCK XSYNC DG BS RSYNC RCLOCK PCMIN
2 kW
AIN AOUT
PD6 PD7 PD8 PD9 PD10 PD11 PD12 PD13 PD14 PD15 SID SICK ISYNC MCK PBS
RST
VDD PD5 PD4 PD3 PD2 PD1 PD0 SOD SOCK OSYNC A/m 8IO CNV/TH 3BIT SADJ SIGI/O C/D IS/P CKOUT
CKRST BTST
ADPCM OUT
MSM6981-01
DATD POWD WDT
EXTI
GND VDD 10 kW
ADPCM IN 1.544 MHz SYNP-A SYNA-A 20 MHz PD6 PD7 PD8 PD9 PD10 PD11 PD12 PD13 PD14 PD15 SID SICK ISYNC MCK PBS
RST
VDD PD5 PD4 PD3 PD2 PD1 PD0 SOD SOCK OSYNC A/m 8IO CNV/TH 3BIT SADJ SIGI/O C/D IS/P CKOUT
CKRST BTST
MSM6981-01
MSM6981-01
DATD POWD WDT
EXTI
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GND
Semiconductor
MSM6981-01
RECOMMENDATIONS FOR ACTUAL DESIGN
Countermeasures for malfunctions caused by instantaneous power supply failures The MSM6981-01 is a digital signal processor (DSP) operated by a built-in program ROM. If the sequence program of device operation runs away, or the stored data in internal memory or in registers is destroyed due to instantaneous power supply failure, the device output becomes abnormal and cannot be recovered automatically unless the external reset signal (RST) is applied. The duration of the instantaneous power supply failure or power voltage drop, and the voltage drop level, which cause malfunctions are specified according to the impedance of the power supply circuit including additional capacitances and inductances, and the pulse waveform at the time of instantaneous power failure. Experimentally, when the duration is about 1 ms or less and the voltage drop level is about 2 V, device malfunctions may occur. To prevent malfunctions due to instantaneous power supply failures, the following actions are recommended. (1) A capacitor (20 mF to 50 mF) and inductance (100 mH to 500 mH) should be inserted closest to the power supply pin of the printed circuit board. (2) A capacitor (0.1 mF to 1.0 mF) should be inserted between the power supply pin and ground pin of the MSM6981-01. (3) A power supply reset signal generation IC should be used. (See the figure below) (4) A WDT monitor circuit should be used.
VDD (+5 V) 1 2.2 kW 10 kW MSM6981-01
PST520D
3
RST 0.01 mF Reset SW WDT
2
WDT Monitor Circuit
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Semiconductor
MSM6981-01
PACKAGE DIMENSIONS
(Unit : mm)
DIP42-P-600-2.54
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 6.20 TYP.
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